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| Micrel ULTRA PRECISION 4x4 CML x SWITCH WITH INTERNAL I/O TERMINATION Precision EdgeTM SY58040U SY58040U FEATURES s Provides crosspoint switching between any input pair to any output pair s Guaranteed AC performance over temperature and voltage: * DC to >5Gbps throughput * <350ps propagation delay * <60ps tr / tf times * <25ps skew (output-to-output) s Unique, patent-pending, channel-to-channel isolation design provides superior crosstalk performance s Ultra-low jitter design: * <1psrms random jitter * <10pspp deterministic jitter * <10pspp total jitter (clock) * <0.7psrms crosstalk-induced jitter s Unique, patent-pending, 50 input termination extended CMVR, and VT pin accepts DC- and ACcoupled differential inputs s 400mV CML output swing s 50 source terminated outputs minimize round-trip reflections s Power supply 2.5V 5% or 3.3V 10% s -40C to +85C temperature range s Available in 44-pin (7mm x 7mm) MLFTM package Precision EdgeTM DESCRIPTION The SY58040U is a low jitter, low skew, high-speed 4x4 crosspoint switch optimized for precision telecom and enterprise server/storage distribution applications. The SY58040U distributes clock frequencies from DC to 4GHz, and data rates to 5Gbps guaranteed over temperature and voltage. The SY58040U differential input includes Micrel's unique, 3-pin input termination architecture that directly interfaces to any differential signal (AC or DC-coupled) as small as 100mV (200mVpp) without any level shifting or termination resistor networks in the signal path. The outputs are 50 source-terminated CML with extremely fast rise/fall times guaranteed to be less than 60ps. The SY58040U features a patent-pending isolation design that significantly improves on channel-to-channel crosstalk performance. The SY58040U operates from a 2.5V 5% or 3.3V 10% supply and is guaranteed over the full industrial temperature range of -40C to +85C. The SY58040U is part of Micrel's high-speed, Precision EdgeTM product line. Data sheets and support documentation can be found on Micrel's web site at www.micrel.com. APPLICATIONS s s s s Data communication systems All SONET/SDH data/clock applications All Fibre Channel applications All Gigabit Ethernet applications Precision Edge is a trademark of Micrel, Inc. MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc. M9999-072904 hbwhelp@micrel.com or (408) 955-1690 Rev.: A Amendment: /0 1 Issue Date: July 2004 Micrel SY58040U FUNCTIONAL BLOCK DIAGRAM IN0 50 VT0 50 0 1 2 3 /IN0 VREF-AC0 Q0 /Q0 IN1 50 0 1 2 3 VT1 50 Q1 /Q1 /IN1 VREF-AC1 IN2 50 0 1 2 3 VT2 50 Q2 /Q2 /IN2 VREF-AC2 0 1 IN3 50 Q3 /Q3 2 3 VT3 50 /IN3 VREF-AC3 SIN0 (CMOS/TTL) SIN1 (CMOS/TTL) SOUT0 (CMOS/TTL) SOUT1 (CMOS/TTL) CONF (CMOS/TTL) LOAD (CMOS/TTL) Control Logic TRUTH TABLES Input Select Address Table SIN1 0 0 1 1 SIN0 0 1 0 1 INPUT IN0 IN1 IN2 IN3 SOUT1 0 0 1 1 Output Select Address Table SOUT0 0 1 0 1 OUTPUT Q0 Q1 Q2 Q3 M9999-072904 hbwhelp@micrel.com or (408) 955-1690 2 Micrel SY58040U PACKAGE/ORDERING INFORMATION GND GND VREF_AC3 IN3 VT3 /IN3 SOUT0 SOUT1 GND GND VCC Ordering Information(1) SY58040U /Q3 Q3 VCC /Q2 Q2 VCC /Q1 Q1 VCC /Q0 Q0 Package Operating Type Range MLF-44 MLF-44 MLF-44 Industrial Industrial Industrial Package Marking SY58040U SY58040U SY58040U with "Y" designator SY58040U with "Y" designator Lead Finish Sn-Pb Sn-Pb Pb-free VREF_AC2 /IN2 VT2 IN2 CONFIG VCC LOAD /IN1 VT1 IN1 VREF_AC1 44 43 42 41 40 39 38 37 36 35 34 1 33 2 32 3 31 4 30 5 29 6 28 7 27 8 26 9 25 24 10 23 11 12 13 14 15 16 17 18 19 20 21 22 GND GND VREF-AC0 /IN0 VT0 IN0 SIN0 SIN1 GND GND VCC SY58040UMI SY58040UMITR(2) SY58040UMY SY58040UMYTR(2) MLF-44 Industrial Pb-free Notes: 1. Contact factory for die availability. Dice are guaranteed at TA = 25C, DC electricals only. 2. Tape and Reel. 44-Pin MLFTM (MLF-44) PIN DESCRIPTION Pin Number 17, 15, 10, 8, 4, 2, 41, 39 16, 9, 3, 40 14, 11, 1, 42 18 19 38 37 5 7 Pin Name IN0, /IN0 IN1, /IN1 IN2, /IN2 IN3, /IN3 VT0, VT1 VT2, VT3 VRef_AC0 VRef_AC1 VRef_AC2 VRef_AC3 SIN0 SIN1 SOUT0 SOUT1 CONF, LOAD Pin Function Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs accept AC or DC-coupled signals as small as 100mV. Each pin of a pair internally terminates to a VT pin through 50. Note that these inputs will default to an indeterminate state if left open. Please refer to the "Input Interface Applications" section for more details. Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The VT pins provide a center-tap to a termination network for maximum interface flexibility. See "Input Interface Applications" section for more details. Reference Voltage: This output biases to VCC-1.2V. It is used when AC coupling the inputs. Connect VRef-AC output pin to the VT input pin. Bypass each VRef-AC pin with a 0.01F low ESR capacitor to VCC. See "Input Interface Applications" section for more details. These single-ended TTL/CMOS-compatible inputs address the data inputs. Note that these inputs are internally connected to a 25k pull-up resistor and will default to a logic HIGH state if left open. These single-ended TTL/CMOS-compatible inputs address the data outputs. Note that these inputs are internally connected to a 25k pullup resistor and will default to a logic HIGH state if left open. These single-ended TTL/CMOS compatible inputs control the transfer of the addresses to the internal multiplexers. See "Address Tables" and "Timing Diagram" sections for more details. Note that these inputs are internally connected to a 25k pull-up resistor and will default to a logic HIGH state if left open. Configuration Sequence 1. Load: Loads configuration into buffer, while Configuration Buffer holds existing switch configuration. 2. Configuration: Loads new configuration into the Configuration Buffer and updates switch configuration. Buffer Mode The SY58040U defaults to buffer mode (IN-to-Q) if the load and configuration control signals are floating. 23, 24, 26, 27, 29, 30 32, 33 6, 22, 25, 28, 31, 34 Q0, /Q0, Q1, /Q1, Q2, /Q2, Q3, /Q3, VCC Differential Outputs: These CML output pairs are the outputs of the device. Please refer to the truth table below for details. Unused output pairs may be left open. Each output is designed to drive 400mV into 100 across the pair, or 50 to VCC. Positive power supply. Bypass with 0.1F//0.01F low ESR capacitors and place as close to each VCC pin. Ground. GND and EPad must both be connected to most negative potential of chip ground. 12, 13, 20, 21, GND, 35, 36, 43, 44 Exposed pad M9999-072904 hbwhelp@micrel.com or (408) 955-1690 3 Micrel SY58040U Absolute Maximum Ratings(1) Power Supply Voltage (VCC ) ...................... -0.5V to +4.0V Input Voltage (VIN) ......................................... -0.5V to VCC CML Output Voltage (VOUT) ......... VCC -0.5V to VCC +5.0V Termination Current(3) Source or sink current on VT pin ........................ 100mA Input Current(3) Source or sink current on IN, /IN .......................... 50mA VREF-AC Current(3) Source or sink current on IN, /IN ............................ 2mA Lead Temperature (soldering, 10 sec.) ..................... 265C Storage Temperature Range (TS ) ........... -65C to +150C Operating Ratings(2) Power Supply Voltage (VCC) ................. +2.375V to +3.60V Ambient Temperature Range (TA) ............. -40C to +85C Package Thermal Resistance(4) MLFTM (JA) Still-Air ............................................................. 23C/W MLFTM (JB) Junction-to-board ............................................ 12C/W DC ELECTRICAL CHARACTERISTICS(5) TA= -40C to +85C, unless otherwise stated. Symbol VCC ICC Parameter Power Supply Voltage Condition VCC = 2.5V. VCC = 3.3V. Power Supply Current No load, max. VCC. Includes current from internal 50 pull-up on each output. 40 80 Note 6 VCC-1.6 0 See Figure 1a. See Figure 1b. 0.1 0.2 1.28 VCC-1.3 VCC-1.2 VCC-1.1 Min 2.375 3.0 Typ 2.5 3.3 225 Max 2.625 3.6 300 Units V V mA RIN RDIFF_IN VIH VIL VIN VDIFF_IN VT_IN VREF-AC Notes: Input Resistance (IN-to-VT, /IN-to-VT) Differential Input Resistance (IN-to-/IN) Input HIGH Voltage (IN-to-/IN) Input LOW Voltage (IN-to-/IN) Input Voltage Swing (IN-to-/IN) Differential Input Voltage Swing |IN - /IN| IN to VT (IN-to-/IN) Output Reference Voltage 50 100 60 120 VCC VIH-0.1 1.7 V V V V V V 1. Permanent device damage may occur if ratings in the "Absolute Maximum Ratings" section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to the limited drive capability, use for input of the same package only. 4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. JA uses 4-layer in still-air number, unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 6. VIH (min), not lower than 1.2V. M9999-072904 hbwhelp@micrel.com or (408) 955-1690 4 Micrel SY58040U CML OUTPUT DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to +85C; RL = 100 across each output pair, unless otherwise stated. Symbol VOH VOUT VDIFF_OUT ROUT Parameter Output HIGH Voltage Q, /Q Output Differential Swing Q, /Q Differential Output Voltage Swing Q, /Q Output Source Impedance See Figure 1a. See Figure 1b. Condition Min Typ Max VCC Units V mV mV 60 VCC-0.040 VCC-0.010 325 650 40 400 800 50 LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(7) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to +85C, unless otherwise stated. Symbol VIH VIL IIH IIL Note: 7. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current Condition Min 2.0 Typ Max VCC 0.8 30 Units V V A A -125 VIL = 0V. -300 M9999-072904 hbwhelp@micrel.com or (408) 955-1690 5 Micrel SY58040U AC ELECTRICAL CHARACTERISTICS(8) VCC = 2.5V 5% or 3.3V 10%; TA= -40C to +85C, RL = 100 across each output pair, unless otherwise stated. Symbol fMAX Parameter Maximum Operating Frequency VOUT 200mV tpd tpd Tempco tS Differential Propagation Delay IN-to-Q CONFIG-to-Q Differential Propagation Delay Temperature Coefficient Set-Up Time SIN-to-LOAD SOUT-to-LOAD LOAD-to-CONFIG CONFIG-to-LOAD tH tSKEW Hold Time LOAD-to-SIN, LOAD-to-SOUT Output-to-Output Skew Part-to-Part Skew tJITTER Data Random Jitter (RJ) Deterministic Jitter (DJ) Clock Cycle-to-Cycle Jitter Total Jitter (TJ) Crosstalk-induced Jitter t r, t f Notes: 8. High-frequency AC-parameters are guaranteed by design and characterization. 9. Output-to-output skew is measured between two different outputs under identical input transitions. 10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs 11. Random jitter is measured with a K28.7 character pattern, measured at Min 5 Typ Max Units Gbps 3 150 225 350 500 225 800 800 800 950 800 GHz ps ps fs/C ps ps ps ps ps 25 150 1 10 1 10 0.7 ps ps psrms pspp psrms pspp psrms ps Note 9 Note 10 Note 11 Note 12 Note 13 Note 14 Note 15 At full output swing, 20% to 80%. 20 40 Output Rise/Fall Time 60 M9999-072904 hbwhelp@micrel.com or (408) 955-1690 6 Micrel SY58040U TYPICAL OPERATING CHARACTERISTICS VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25C, unless otherwise stated. Output Amplitude vs. Frequency 440 OUTPUT AMPLITUDE (mV) WITHIN DEVICE SKEW (ps) 420 400 380 360 340 320 0 2000 4000 6000 PROPAGATION DELAY (ps) 20 18 16 14 12 Within-Device Skew vs. Temperature (Referenced to Q0) Q0 Q1 Propagation Delay vs. Temperature 270 265 260 255 250 245 240 235 -40 -20 0 20 F = 200MHz 40 60 80 100 10 8 6 4 2 0 -40 -20 Q2 Q3 40 60 80 100 0 20 FREQUENCY (MHz) TEMPERATURE (C) TEMPERATURE (C) M9999-072904 hbwhelp@micrel.com or (408) 955-1690 7 Micrel SY58040U FUNCTIONAL CHARACTERISTICS VCC = 3.3V, GND = 0, VIN = 100mV, TA = 25C, unless otherwise stated. 200MHz Output 622MHz Output Output Swing (100mV/div.) Output Swing (100mV/div.) TIME (200ps/div.) TIME (100ps/div.) 5Gbps Output (Q - /Q) Output Swing (200mV/div.) TIME (50ps/div.) M9999-072904 hbwhelp@micrel.com or (408) 955-1690 8 Micrel SY58040U SINGLE-ENDED AND DIFFERENTIAL SWINGS VIN, VOUT 400mV (Typ.) VDIFF_IN, VDIFF_OUT 800mV (Typ.) Figure 1a. Single-Ended Voltage Swing Figure 1b. Differential Voltage Swing INPUT AND OUTPUT STAGES VCC VCC VCC 50 /Q 50 ZO = 50 100 50 /Q 50 ZO = 50 IN Q 50 VT GND 50 /IN Q ZO = 50 ZO = 50 100mA DC bias per application 100mA GND GND Figure 2a. Simplified Differential Input Stage Figure 2b. CML DC-Coupled (100 Termination) Figure 2c. CML AC-Coupled (50 Termination) M9999-072904 hbwhelp@micrel.com or (408) 955-1690 9 Micrel SY58040U INPUT INTERFACE APPLICATIONS VCC VCC IN VCC IN LVPECL /IN VCC GND 0.01F NC Rpd VT SY58040U LVPECL /IN Rpd GND Rpd VCC GND 0.01F For 3.3V, Rpd = 100. For 2.5V, Rpd = 50. VT VREF-AC SY58040U CML IN /IN SY58040U GND NC NC VT VREF-AC VREF-AC For VCC = 3.3V, Rpd = 50. For VCC = 2.5V, Rpd = 39. Option: May connect VT to VCC. Figure 3c. CML Interface (DC-Coupled) Figure 3a. LVPECL Interface (DC-Coupled) VCC Figure 3b. LVPECL Interface (AC-Coupled) VCC IN CML /IN SY58040U GND VCC VT VREF-AC 0.01F IN LVDS /IN SY58040U GND NC NC VT VREF-AC Figure 3d. CML Interface (AC-Coupled) Figure 3e. LVDS Interface RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION Part Number SY58040U Function Ultra Precision 4x4 CML Crosspoint Switch with Internal Input/Output Termination MLFTM Application Note HBW Solutions New Products and Applications Data Sheet Link http://www.micrel.com/product-info/products/sy58040u.shtml www.amkor.com/products/notes_paper/MLF_AppNote.pdf www.micrel.com/product-info/products/solutions.shtml M9999-072904 hbwhelp@micrel.com or (408) 955-1690 10 Micrel SY58040U 44 LEAD MicroLeadFrameTM (MLF-44) Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane PCB Thermal Consideration for 44-Pin MLFTM Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: 1. Package meets Level 2 qualification. 2. All parts are dry-packaged before shipment. 3. Exposed pads must be soldered to a ground for proper thermal management. MICREL, INC. TEL 1849 FORTUNE DRIVE SAN JOSE, CA 95131 FAX USA + 1 (408) 944-0800 + 1 (408) 474-1000 WEB http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2004 Micrel, Incorporated. M9999-072904 hbwhelp@micrel.com or (408) 955-1690 11 |
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